Established in 1999, BDC International Co., Ltd, in the last few years, seizes the chance of electronic industry and continuously progress. Now it has grown into a comprehensive enterprise group. Its subsidiary companies are as below:
¡óBDC International (HK) Co., Ltd
¡óPengdacheng Science & Technology (HK) Co., Ltd
¡óShenzhen Pengdacheng Electronic Co., Ltd
¡óPengdacheng Mingda (Shenzhen) Co., Ltd
¡óShenzhen Gongtong Communications Co., Ltd
¡óShenzhen Chengda Co., Ltd
¡óBoshang Electronic International Co., Ltd
¡óShanghai Suoming Electronic Co., Ltd
¡óAmerica BDC International Electronic Parts Co., Ltd
And Beijing, Suzhou, Xiamen, Ningbo, Dongguan, Zhongshan, Hong Kong and Taiwan branch.
Excellent talent policy makes BDC stably stand in the strong competitive market. Based on the electronic components, BDC put much manpower, capital and equipments in the Multilayer Ceramic Chip Capacitor, Chip Tantalum Capacitor, Chip Resistor and Blister Packing to develop. It ensures the high quality and convenient transportation system and make production, OEM and sales meet customers¡¯ requests in time.
With the company development, BDC realize that the wireless telecommunication is another perfect field that BDC can offer continual service to customers and in 2005 established the wireless telecommunication department that specializes in the research, development, production and sales of 2.5G/3G wireless products. Products include CDMA, WCDMA & TD-SCDMA wireless modem with PCMCIA, EXPRESS or USB2.0 interface. Depending on the continual research & development and multi-channel sales, BDC brand must gain expectant success.
BDC great development plan make the company progress quickly. It outlook the world and explores the market actively. BDC will provide global customers with more and good products and first class services.
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